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ALL CATEGORIES   Semi / Hybrid Assy   Die Bonders

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	View All Offers Under Flip Chip Bonders » Switch Major Category		Click an item's ID# below for its full specifications and source, or: Group Offers into sub-categories under Flip Chip Bonders List all 2 product types under Flip Chip Bonders

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Item ID  Photo Short Description Product Type / Details # Price Notes Location Make Model   $   213293 ASM   ASM   Siplace CA4  Automatic Flip Chip Bonders in Flip Chip Bonders ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch: SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems  - 4 LP-Kamera (TYP34) and bonding Head C+P20 - excluding Loader     1   Regensburg, Bavaria 64751 Kulicke & Soffa   Kulicke & Soffa   6496  Manual Flip Chip Bonders in Flip Chip Bonders K&S 6496 Die Bonder - Parts Tool Only: Semi-Automatic Hybrid Epoxy Die Bonder - PARTS TOOL ONLY 1   F* Plano, TX 120396 Kulicke & Soffa   Kulicke & Soffa   6497  Manual Flip Chip Bonders in Flip Chip Bonders K&S 6497: Semiautomatic Flip Chip Die Bonder 1   F* Plano, TX

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
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   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Flip Chip Bonders: ASM, Kulicke & Soffa